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bEMC Showcases Innovative microLED Optical Interconnect Solution at OFC 2026

  • bEMC Showcases Innovative microLED Optical Interconnect Solution at OFC 2026
  • A significant milestone for bEMC; KGI Securities assists in listing on the OTC market.
  • bEMC Accelerates microLED for CPO Innovation with New Semipolar IP License
  • bEMC Unveils Breakthrough Ultra-Low Power, High-Speed Light Source (μ3DTx™) for Targeting 1.6Tbps & 1 pj/bit for AI Data Center Chiplet Interconnects
  • bEMC Showcases Breakthrough Multi-Channel Array and High-Power InP CW DFB Technologies at OFC 2025

We are providing the trendy Silicon and Photonics integration for pursuing the ultra low power solutions.

Features

  • Inp CW
  • GaAs high speed VCSEL
  • Multi-Channel Array Light Source
  • High-Power InP CW DFB Laser
  • 4″ and 6″ epitaxy wafers
  • CPO design

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