News

Zhunan Science Park, Taiwan — August 1st 2025 — bEMC ( best Epitaxy Manufacturing Company), a pioneer in advanced photonic semiconductor solutions, proudly announces the launch of μ3DTx™, a next-generation ultra-low power, high bandwidth light source designed to meet the evolving demands of chiplet interconnects in AI data center connectivity.

The μ3DTx™ platform leverages micro LED technology to deliver not only exceptional bandwidth scalability and long-term reliability, but also breakthrough levels of energy efficiency. It is engineered to enable high-speed, low-latency communication in chiplet-based AI architectures, paving the way for next-generation computing performance.

Key Features of μ3DTx™ include:

· Optimized Performance: Utilizes a semi-polar GaN template on the sapphire substrate for enhanced performance and precise emission control.

· Superior Integration: Features a micro LED flip-chip design seamlessly integrated via CoW (Chip-on-Wafer) technology, ensuring exceptional thermal and electrical performance.

· High-Density Scalability: Supports 3D stacking integration on silicon platforms, enabling the creation of compact, high-density photonic architectures crucial for future AI systems.

· Enhanced Manufacturability: Includes robust Si interposer layout and a refined bonding process with KGD (Known-Good-Die) to guarantee high yield, scalability, and manufacturability for mass production.

“The launch of μ3DTx™ marks a significant milestone in our roadmap toward enabling energy-efficient, high-performance optical engines for next-generation AI systems,” said Evan Wu, General Manager of bEMC. “Our team is proud to showcase a state-of-the-art light source technology that not only pushes the bandwidth boundary, but also addresses the critical power and integration challenges of tomorrow’s AI infrastructure.”

We will be showcasing our products and technologies at 2025 OCP APAC Summit (https://www.opencompute.org/summit/2025-ocp-apac-summit)

Time: August 5th & 6th.

Address: 7F, Taipei TaiNEX2, Taipei, Taiwan. Booth No: G01

Welcome to visit us for the most upcoming information.

Media Contact: Frank Chen

e-mail: frankchen@best-epitaxy.com

About bEMC

bEMC specializes in cutting-edge photonic semiconductor development, focusing on InP, GaN and GaAs epitaxy and chip solutions for data communications, sensing, and advanced computing applications. With vertically integrated capabilities and a commitment to innovation, A Company empowers the future of connectivity. Visit us at https://best-epitaxy.com

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