Micro LED
Abstract of bEMC ultra lower power CPO
The growing demand for high-bandwidth, low-latency, and energy-efficient optical communication has accelerated the development of advanced optical engines. This proposal focuses on the development of a parallel Micro LED array on a silicon (Si) interposer for AI datacom applications. The integration aims to achieve high-density, high-bandwidth optical transmission while leveraging the manufacturability and cost-efficiency of silicon-based processes.
What is μ3DTx™?
- low Power Consumption Soluiton, < 1 pj/bit
- 1.6Tb/3.2Tb AOC for Scale up
- 12” Silicon compatible platform (SiPh integration)
- Extendable for Chip to Chip interconnect
- Cost effective for optical interconnect
Micro LED for datacom application capability
Key technology for μ3DTx ™ ?
bEMC μ3DTx Know Good Die (KGD) results ™
Semi-Polar Substrate
Semi-polar micro LED array on Silicon interposer
3db measurement
3D Xray (bonding performance)
μ3DTx™ Performance and Roadmap
Speed
Power Consumption
- Silicon adaptive platform
- Unique and innovative technology; 3D stacking integration in light source (μ3DTxTM), 2.5D integration in optical engine
- Ultra low power (50%+ power reduction) with high bandwidth (1.6Tb+)
- Scalability and reliable